Panoramic-vision dispensing systems use feature-matching positioning and support 3-, 4- or 5-axis configurations. Image-based programming replaces complex teach-point workflows with intuitive path definition, supporting high-mix, low-volume production. The Linux-based platform includes upstream and downstream conveyor communication and supports both SMEMA and HERMES.
Designed for discrete-device packaging, particularly ASIC encapsulation and precision solder-paste application in MEMS processing. Supported package formats include leadframe, substrate, and shell-and-case packages. Applications include chip coating, solder-paste application, potting, component reinforcement and underfill.
Product Features
1. High-performance vision positioning based on fiducial shape features.
Handles different shapes and lighting conditions; printed markings can be selected as fiducials.
Single-fiducial positioning is supported in suitable demanding applications.
2. Image-based programming provides direct, visual path definition, simplifying precision-dispensing setup and improving programming efficiency.
3. VMotion motion control with a 1 ms control cycle.
High-speed, precise control with extensibility for customized functions.
Position-compare output and equally spaced corner output support accuracy and consistency during high-speed dispensing.
4. On-the-fly inspection.
Rapid inline inspection of dispensing results; the source reports a 1–2× inspection-efficiency improvement with on-the-fly imaging.
5. Industrial communication support.
Supports SCADA, HERMES, SECS/GEM and customized MES integration.
6. Mixed-product production.
Multiple products can run on the same line, reducing changeovers in high-mix, low-volume production.
Technical Specifications
| Category | Item | G400-F3C Series | |
| Configuration | Configuration | 3-axis (clean-environment configuration) | |
| Installation | Inline rail conveyor integration | ||
| Dispensing materials | Adhesive, solder paste, silver paste and more | ||
| Valve configuration | Single valve | Adjustable dual valves | |
| Dispensing Parameters | Dispensing travel | Single lane: 350 × 450 mm Dual lane: 350 × 210 mm | Single lane: 150 × 450 mm (individual board / panel size) Dual lane: 150 × 210 mm (individual board / panel size) |
| Maximum component height | Board clearance: 30 mm | ||
| Minimum solder-paste dot diameter | Minimum solder-paste dot diameter: 0.15 mm | ||
| Minimum adhesive dot diameter | Minimum adhesive dot diameter: 0.2 mm (strongly dependent on adhesive properties) | ||
| PCB edge clearance | ≥4mm | ||
| Conveyor System | Board flow direction | Left to right (standard); right to left (optional) | |
| Conveyor height | 900±20mm | ||
| Conveyor width adjustment | Software-controlled width adjustment | ||
| Weighing accuracy | 0.1mg | ||
| Conveyor speed | 2-24m/min | ||
| Control and Motion System | Control architecture | Motion, vision, dispensing and application software controlled by one industrial PC | |
| Dispensing software | Integrated software running on Linux | ||
| Programming | Image-based and offline programming | ||
| Communication protocols | SCADA, HERMES, SECS/GEM and other industrial protocols; customized MES integration available | ||
| Maximum acceleration | 1.5/2.0g | ||
| Repeatability | ±0.005 | ||
| Drive system | Servo drive + linear motor | ||
| Vision System | Camera | 1.3 MP industrial camera | |
| Illumination | Multicolor, multifunction combined illumination | ||
| Vision System | Integrated vision system | ||
| Dimensions & Utilities | Dimensions and weight | L860 × W1280 × H1900 mm (H1620 mm excluding filtration system) Approximately 1,050 kg | |
| Power supply | 2.5 kW, AC220 V, 50 Hz (without conveyor heating) | ||
| Air supply | 0.6Mpa | ||
| Other | Options | Board loader/unloader | |
| Barcode reading | |||
| Dual lane | |||
| Dispensing inspection | |||
Confirm the exact model, board dimensions, material, valve arrangement and process acceptance criteria with JCX before ordering.
Applications and Project Support
Industry Applications
Process Guides
These application routes support equipment discussion. The selected material, process or inspection task still requires a configuration review.
