Semiconductors / Advanced Packaging
Precision dispensing and process planning for semiconductor assemblies and advanced packaging applications.
Typical Applications
- Underfill and package-level material application
- Dam-and-fill, encapsulation and selected sealing processes
- Module assembly and precision electronics packaging
Process Planning
01 · Characterize the application
Review package geometry, dispensing location, substrate features and material behavior before choosing the process.
02 · Match motion, vision and valve
Evaluate the required path, positioning method, access and valve options against representative samples.
03 · Validate the dispensing window
Confirm deposit consistency, material preparation, maintenance and downstream curing requirements through application trials.
What to Share With JCX
- Package and substrate drawings with target dispense locations
- Material datasheet, viscosity range and handling requirements
- Deposit geometry, positioning tolerance and acceptance method
Equipment and process configuration are reviewed against your drawings, materials, samples and acceptance criteria.
Equipment to Evaluate
Use these configurations as starting points for an application review. Click a product card to read its specifications and options.
Match the Process to the Configuration
| Process | Model to review | Starting point | Confirm before selection |
|---|---|---|---|
| Package-level material application | G400-F3C | Explore dispensing configurations documented for discrete-device packaging and underfill. | Confirm substrate or carrier, deposit geometry, material compatibility and environmental requirements. |
| Board-level underfill / encapsulation | G201-F3 | Evaluate vision-guided dispensing around compatible assemblies. | Review gap, flow path, valve access, temperature and curing conditions. |
Package-level work and board-level dispensing need different reviews. Wafer handling, die bonding, wire bonding and hidden-joint inspection are not assumed capabilities of these configurations.
Plan Your Application With JCX
Share your product drawings and process requirements so we can discuss the equipment configuration and next steps.