G201 Precision Dispensing Series: Image Programming and Non-Contact Jetting
VISEE source archive · 2024-08-12
English editorial edition. Company history, project announcements and qualifications refer to the original publisher. They are not JCX company credentials. View original source.
VISEE introduced the G201 high-speed precision dispensing series in 2023. The source describes a compact design for different PCB sizes, with image-based programming that reduces complex teaching operations and supports straightforward operator interaction.
The system combines primary and secondary cameras to support positioning and ease of use. Non-contact high-speed jetting enables smaller deposits. Applications include chip and lead encapsulation, underfill, dam-and-fill, SMT red adhesive, solder paste, silver paste and FPC component reinforcement.
Whole-board recognition and fiducial recognition support positioning. Automatic board identification, program selection and production-data statistics are also described. The article reports customer interest in the range and outlines continued product development and regional application support by the original manufacturer.
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